Method of fabricating three-dimensional components using endpoint detection
US6559058B1 · kind B1 · utility
0Cited by
10References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 31, 2002 |
| Grant date | May 6, 2003 |
| Priority date | — |
| Expiry date | Jan 31, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/30604
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
One embodiment of the present invention provides a system for using selective etching to form three-dimensional components on a substrate. The system operates by receiving a substrate composed of a first material. Next, a second layer composed of a second material is formed on selected portions of the substrate. A third layer composed of a third material is then formed over the substrate and the second layer. Finally, an etching operation using a selective etchant is used to remove the second layer, thereby leaving the substrate, which forms a first active layer, and leaving the third layer, which forms a second active layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.