Method of separating two layers of material from one another and electronic components produced using this process

US6559075B1 · kind B1 · utility

Assignee

• Siemens Aktiengesellschaft · DE

Inventors

• Michael Kelly · Queen Creek, US
• Oliver Ambacher · Neufahrn, DE
• Martin Stutzmann · Erding, DE
• Martin Brandt · Schömberg, DE
• Roman Dimitrov · San Jose, US
• Robert Handschuh · Burgkirchen an der Alz, DE

Key dates

• Filing date: Apr 1, 1999
• Grant date: May 6, 2003
• Expiry date: Apr 1, 2019

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10S438/977
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A method of separating two layers of material from one another in such a way that the two separated layers of material are essentially fully preserved. An interface between the two layers of material at which the layers of material are to be separated, or a region in the vicinity of the interface, is exposed to electromagnetic radiation through one of the two layers of material. The electromagnetic radiation is absorbed at the interface or in the region in the vicinity of the interface and the absorbed radiation energy induces a decomposition of material at the interface.