Patent · US Expired

Device for attaching a semiconductor chip to a chip carrier

US6559523B2 · kind B2 · utility

4Cited by

5References

16Claims

0Family size

Assignee

TEXAS INSTRUMENTS INCORPORATED · US

Inventors

Hermann Schmid · Binghamton, US
Wolfgang Ramin · Freising, DE
Nusret Yilmaz · Freising, DE
Heinrich Brenninger · Kranzberg, DE

Key dates

Filing date	Apr 19, 2001
Grant date	May 6, 2003
Priority date	—
Expiry date	Apr 19, 2021

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/19043
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

In a device for attaching a semiconductor chip (10) to a chip carrier (12), thereby producing an electrically conducting connection between contact areas (22, 24) arranged on a surface of the semiconductor chip (10) and contact areas (26, 28) on the chip carrier (12) by means of an anisotropically conducting film (16) or an anisotropically conducting paste (16), a pressure die (18) is used for the application of the pressure to the chip (10) with an adjustable pressing force against the chip carrier (12). A counter-pressure support (14) accepts the chip carrier (12) with the semiconductor chip (10) arranged on it with the interposition of the anisotropically conducting film (16) or the anisotropically conducting paste (16). An elastic body (20) is arranged either between the pressure die (14) and the semiconductor chip (10) or between the chip carrier (12) and the counter-pressure support (14).

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.