Butted sensor array with supplemental chip in abutment region
US6559956B2 · kind B2 · utility
7Cited by
14References
10Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 27, 1999 |
| Grant date | May 6, 2003 |
| Priority date | — |
| Expiry date | May 27, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04N2201/02487
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention relates to photosensitive chips for creating electrical signals from an original image, as would be found for example in a digital scanner, copier, facsimile machine, or other document generating or reproducing device. More specifically, the present invention relates to preferably providing a supplemental chip in each abutment region to enhance image quality.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.