Interconnection process and interface using parallelized high-speed serial links
US6560275B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 14, 2002 |
| Grant date | May 6, 2003 |
| Priority date | — |
| Expiry date | May 14, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04J2203/0089
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
An interconnection interface for transmitting digital data between a sending module and a receiving module connected to one another through point-to-point serial links, forming a global data link. Each of the modules are provided, firstly, with a multiplexing unit associated with each of the serial links disposed in the module's physical layer, so as to distribute data transmitted through the global link at a speed determined by the sending module to a given number of parallel links, with each of these parallel links conveying a part of the transmitted data at a speed higher than the sending module data speed; and secondly, with a demultiplexing unit associated to the parallel links conveying received data parts, so as to synchronously and integrally reconstitute these received data parts at a speed accepted by the receiving module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.