Lamination system
US6561248B2 · kind B2 · utility
3Cited by
12References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 5, 2002 |
| Grant date | May 13, 2003 |
| Priority date | — |
| Expiry date | Apr 5, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1744
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A lamination system of the present invention comprises; a film transfer means for transferring a continuous film, a cutting means for cutting the film, a card transfer means for transferring an ID card, a thermocompression bonding means for laminating the film to the ID card, a card straightening means straightening the ID card bent during the thermocompression bonding, in which a spring up suppression means for suppressing a spring up of a trailing edge of the ID card leaving the thermocompression bonding means is provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.