Cooling apparatus for electronic devices
US6561261B2 · kind B2 · utility
14Cited by
7References
25Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 3, 2001 |
| Grant date | May 13, 2003 |
| Priority date | — |
| Expiry date | Dec 3, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat sink for removing heat from a heat source. The heat sink has at least one first surface adapted to contact at least a portion of the heat source located on a core member. At least one outer peripheral surface is located on the core member. At least one cooling fin device comprising at least one inner peripheral surface and a plurality of cooling fins are adjacent the outer peripheral surface of the core member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.