Socket plane
US6561820B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 27, 2001 |
| Grant date | May 13, 2003 |
| Priority date | — |
| Expiry date | Sep 27, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R43/205
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method and apparatus for a conductive plate for a socket. The conductive plate includes a plurality of openings. The conductive plate is electrically connected to ground and is contained within a socket that may receive an electronic package. The openings allow pins from the electronic package to pass through to contacts in the socket. The diameter of each opening is customizable to produce desired impedance between the electronic package pin inserted in the contact and the conductive plate. Impedance discontinuity seen by signals passing through the socket from the electronic package pins is reduced. The electronic plate may contain one or more pins insertable into contacts in the socket where the contacts provide the electrical connection to ground.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.