Solution and process to pretreat copper surfaces

US6562149B1 · kind B1 · utility

Assignee

• Atotech Deutschland GmbH & Co. KG · DE

Inventors

• Udo Grieser · Berlin, DE
• Heinrich Meyer · Berlin, DE

Key dates

• Filing date: Aug 22, 2000
• Grant date: May 13, 2003
• Expiry date: Aug 22, 2020

Classification

• Technology area (CPC H): Electricity
• CPC primary: H05K2203/124
• WIPO field: Audio-visual technology
• WIPO sector: Electrical engineering

Abstract

The invention concerns processes and solutions for the preliminary treatment of copper surfaces which are subsequently to be firmly bonded to organic substrates. The solution is used, in particular, for firmly bonding laminated multilayered printed circuit boards and for firmly bonding resists to the copper surfaces of printed circuit boards. The solutions contain (a) hydrogen peroxide; (b) at least one acid; (c) at least one nitrogen-containing, five-membered heterocyclic compound which does not contain any sulphur, selenium or tellurium atom in the heterocycle; and (d) at least one adhesive compound from the group consisting of sulfinic acids, seleninic acids, tellurinic acids, heterocyclic compounds containing at least one sulphur, selenium and/or tellurium atom in the heterocycle, and sulfonium, selenonium and telluronium salts having the general formula (A), in which A stands for S, Se or Te; R1, R2 and R3 stand for alkyl, substituted alkyl, alkenyl, phenyl, substituted phenyl, benzyl, cycloalkyl, substituted cycloalkyl, R1, R2 and R3 being the same or different; and X− stands for an anion of an inorganic or organic acid or hydroxide, provided that the acid selected to c…