Method of controlling a compression injection molding machine
US6562264B1 · kind B1 · utility
4Cited by
5References
1Claims
0Family size
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Inventors
Key dates
| Filing date | Sep 7, 2000 |
| Grant date | May 13, 2003 |
| Priority date | — |
| Expiry date | Dec 27, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2017/005
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method of controlling a compression injection molding machine having a movable die mounted on a movable die plate including using a pressure sensor to detect a reaction force produced at the movable die by resin being injected into a die cavity. The pressure sensor is positioned between the movable die plate and a housing supporting a toggle driving mechanism that moves the movable die plate and movable die. The output of the sensor is applied to control the injection of the resin into the die cavity or the thickness of the resin. This output can also control gate cutting or resin injection speed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.