Method and apparatus for forming deposition film, and method for treating substrate
US6562400B2 · kind B2 · utility
3Cited by
13References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 30, 2001 |
| Grant date | May 13, 2003 |
| Priority date | — |
| Expiry date | Apr 30, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/50
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A gas adsorptive member is disposed in a space communicating with film deposition chambers, and deposition films are deposited while continuously feeding gas components released from this member, thereby enabling the high quality and uniform deposition films to be formed on the substrate with good reproducibility.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.