Tag and label comprising same
US6562454B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 4, 2001 |
| Grant date | May 13, 2003 |
| Priority date | — |
| Expiry date | Dec 4, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2848
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
An IC tag and label are provided which allow data to be recorded on the surface thereof, are free from security problem that the inner IC circuit or wiring circuit can be seen through, exhibit excellent strength and water resistance, can be used even in the atmosphere and water and can be used for frozen food vessels, industrial products, various chemical vessels, etc. and for flow control, production line control, etc. The IC tag has a laminated structure that includes a thermoplastic resin film layer (A), an adhesive layer (D), and an IC circuit layer (B) or an IC circuit protective layer (C) having a hole containing an IC circuit layer (B). The IC label has a laminated structure that includes a thermoplastic resin film layer (A), an adhesive layer (D), an IC circuit layer (B) or an IC circuit protective layer (C) having a hole containing an IC circuit layer (B), and an adhesive layer (G). An airline tag includes the IC label.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.