Silicone composition for forming cured release coatings
US6562469B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 18, 2001 |
| Grant date | May 13, 2003 |
| Priority date | — |
| Expiry date | Dec 18, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31663
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A solventless silicone composition for forming a cured release coating comprising(A) 100 parts by weight of a mixture comprising 99 to 90 parts by weight of (A-1) a linear diorganopolysiloxane having a viscosity of 5 to 1,000 mPa·s at 25° C., having both terminal ends of the molecular chain blocked by dimethylalkenylsiloxy groups, with an alkenyl group content of 0.2 to 10 mol % of all organic groups and 1 to 10 parts by weight of (A-2) a linear diorganopolysiloxane having a viscosity of 1,000 to 10,000 mPa·s at 25° C. having both terminal ends of the molecular chain blocked by trimethylsiloxy groups and having at least two pendant alkenyl groups bonded to silicon atoms, with an alkenyl group content of 0.05 to 0.5 mol % of all organic groups,(B) 3 to 50 parts by weight of an organohydrogenpolysiloxane having a viscosity of 1 to 1,000 mPa·s at 25° C. having at least three silicon-bonded hydrogen atoms per molecule, and(C) a catalytic amount of a platinum catalyst.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.