Heat sealing composition, use thereof and closure plug made from said composition
US6562477B1 · kind B1 · utility
5Cited by
5References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 2, 2001 |
| Grant date | May 13, 2003 |
| Priority date | — |
| Expiry date | May 2, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31935
- WIPO fieldHandling
- WIPO sectorMechanical engineering
Abstract
The invention concerns a heat sealing composition including an adhesive framework and a framework forming constituent, the adhesive constituent being a maleic vinyl-anhydride ethylene-acetate polymer or a vinyl ethylene-acetate polymer modified to have epoxy functions and the framework forming constituent being selected from among a block polyether amide, modified or not, and a block polyether ester. The composition is useful for making closure plugs.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.