Microelectronic assembly with die support and method
US6562663B2 · kind B2 · utility
11Cited by
19References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 28, 2001 |
| Grant date | May 13, 2003 |
| Priority date | — |
| Expiry date | May 17, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A microelectronic assembly includes a substrate having a plurality of bond pads disposed on a substantially planar die attach surface and an integrated circuit die having a die face and a plurality of bond pads of the die face. The die is provided with a polymeric bead about the outer edges of the die. Die face bond pads are aligned with corresponding substrate bond pads and electrically interconnected by heating to a reflow temperature. Exposure of the polymeric bead to the reflow temperature causes the bead to form a peripheral bond between the die and the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.