Radiating enclosure
US6563042B2 · kind B2 · utility
11Cited by
16References
24Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 21, 1999 |
| Grant date | May 13, 2003 |
| Priority date | — |
| Expiry date | May 21, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04B1/38
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
An integrated radiating enclosure is disclosed. The enclosure housing is formed from a dielectric material with a radiating element formed on the exterior surface of the housing and a groundplane material formed on the interior of the housing. The groundplane provides EMI shielding for the enclosed electronics. The three antenna elements are directly connected to the circuitry of a transceiver system, thereby integrating the transceiver antenna components directly into the transceiver enclosure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.