Multilayered circuit board and method for producing the same
US6563058B2 · kind B2 · utility
10Cited by
10References
10Claims
0Family size
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Key dates
| Filing date | Mar 8, 2001 |
| Grant date | May 13, 2003 |
| Priority date | — |
| Expiry date | Mar 8, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09563
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multilayered circuit board is constructed such that holes penetrating through second and third dielectric layers, interposed between a pair of electrodes for constructing a capacitor, are filled with a material having a high dielectric constant respectively in a capacitor-forming area, and a plurality of (for example, four) holes are filled with a material having a high magnetic permeability respectively so as to penetrate through first to fifth dielectric layers in a magnetic flux-passing area of a coil constructed by coil electrodes of first to fifth turns in a coil-forming area.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.