Method of forming an electrode
US6563075B1 · kind B1 · utility
9Cited by
23References
61Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 20, 2001 |
| Grant date | May 13, 2003 |
| Priority date | — |
| Expiry date | Dec 20, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05H1/3442
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of fabricating an electrode is disclosed, wherein the electrode comprises a copper holder defining a cavity in a forward end. An emissive element and separator assembly is positioned in the cavity. An intermetallic compound is formed between the emissive element and the separator by heating a relatively non-emissive material until it melts and dipping the emissive element therein before cooling the assembly. As a result, the intermetallic compound is formed significantly faster than by conventional methods.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.