Method for machining work by laser beam
US6563079B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 23, 2000 |
| Grant date | May 13, 2003 |
| Priority date | — |
| Expiry date | Oct 23, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/81
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A method for processing a work in which a processed hole with a high aspect ratio is formed by laser machining. Silicon oxide films (2) are formed as protective films on front and rear surfaces, respectively, of a silicon substrate (1). The silicon substrate (1) is irradiated with a laser light through the protective films (2) to thereby perform a perforating process. Alternatively, the silicon substrate (1) is irradiated with a circularly or randomly polarized laser light. Hence, a processed hole with a high aspect ratio can be obtained. Moreover, the processed hole can be shaped straightly, so that processing accuracy is improved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.