Laser cutting method, laser cutting apparatus, and method and apparatus for manufacturing liquid crystal device
US6563082B2 · kind B2 · utility
42Cited by
6References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 14, 2001 |
| Grant date | May 13, 2003 |
| Priority date | — |
| Expiry date | Sep 14, 2021 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02F1/133351
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Scribe lines are formed in advance at cutting locations on both surfaces of a panel formed by bonding an upper substrate and a lower substrate to each other via a sealing material, and a laser beam is applied to each of the scribe lines on both surfaces, by which a liquid crystal panel having a product size is obtained.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.