Adhesive pad having EMC shielding characteristics
US6563198B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Aug 17, 2001 |
| Grant date | May 13, 2003 |
| Priority date | — |
| Expiry date | Aug 17, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention is directed to the present invention is directed to an adhesive pad with electromagnetic compatibility (EMC) characteristics. An adhesive pad suitable for bonding electrical components may include a thermal bonding adhesive material and a lattice interlayer. The adhesive material is suitable for being disposed between the first electrical component and the second component, the thermal bonding adhesive bonding the first electrical component to the second component. The lattice interlayer is included within said thermal bonding adhesive material, the lattice interlayer having electromagnetic capability (EMC) shielding characteristics.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.