Lead frame for semiconductor devices, a semiconductor device made using the lead frame
US6563199B2 · kind B2 · utility
26Cited by
3References
29Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 20, 2001 |
| Grant date | May 13, 2003 |
| Priority date | — |
| Expiry date | Mar 22, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1815
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device having a unit lead frame defining a support with a peripheral edge and a first lead spaced from the peripheral edge. The first lead has a recess formed therein. A semiconductor chip is provided on the support. A conductive element electrically connects between the semiconductor chip and the first lead. The resin layer on the semiconductor chip and the first lead extends into the recess. The invention is also directed to a unit lead frame that is part of the semiconductor device, a lead frame incorporating a plurality of unit lead frames, and a method of manufacturing semiconductor devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.