Electronic component and method of manufacturing the same
US6563214B2 · kind B2 · utility
5Cited by
7References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 27, 2001 |
| Grant date | May 13, 2003 |
| Priority date | — |
| Expiry date | Jul 27, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An electronic component having a substrate on which one or more grooves are formed on its opposing side faces; electrodes formed on the groove and top and bottom faces of the substrate at a portion adjacent to the groove; and a circuit element formed between the electrodes. An electrode is also formed on the opposing side faces of said substrate at a portion other than the grooves. This structure enables to improve the reliability of a soldered portion even for small electronic components with about 10 &mgr;m thick electrodes such as chip resistors, chip capacitors, and chip inductors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.