Solderless laser assembly
US6563696B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 17, 2001 |
| Grant date | May 13, 2003 |
| Priority date | — |
| Expiry date | Nov 7, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/02251
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A connect and disconnect assembly for connecting and disconnecting a laser diode having leads to a printed circuit board (PCB). The assembly includes a heatsink that connects with the printed circuit board by providing cap screws through the PCB which are threadably received in spacers connected to the heatsink. A connection assembly made up of a retainer block and screws connects the laser diode to the heatsink. The laser diode is provided through a cutout portion of the PCB, and connects to the heatsink by providing the screws through the retainer block and the laser diode, the screws being threadably received in the heatsink. A pair of fuzz button carriers are interposed between the laser diode and the PCB. Each fuzz button carrier has a body portion, spaced guide portions extending above the body portion, and fuzz buttons extending through the body portion. When the laser diode is connected to the heatsink, the laser diode leads are provided between the guide portions of the fuzz button carriers and contact the fuzz buttons. The fuzz buttons, in turn, electrically connect the laser diode leads to the PCB pads. The assembly provides a convenient mechanism for connecting/disconne…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.