Method and apparatus for planarizing semiconductor device
US6565424B2 · kind B2 · utility
5Cited by
6References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 24, 2001 |
| Grant date | May 20, 2003 |
| Priority date | — |
| Expiry date | May 24, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/32
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The invention provides a process apparatus including a wafer holder, and a process method, in which high planarization performance, scratch free process, narrow edge exclusion and high uniformity can be maintained for more than 10,000 processed wafers. The invention is achieved by providing a unit for keeping a retainer and surface of a polishing wheel non-contact with each other and controlling the gap within a certain range and by setting compression strength of the retainer at more than 3,000 kg/cm2.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.