Polishing composition and polishing method employing it
US6565619B1 · kind B1 · utility
26Cited by
10References
4Claims
0Family size
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Key dates
| Filing date | Oct 4, 2002 |
| Grant date | May 20, 2003 |
| Priority date | — |
| Expiry date | Oct 4, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/3212
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A polishing composition comprising:(a) colloidal silica having a positively charged surface,(b) colloidal silica having a negatively charged surface,(c) at least one acid selected from the group consisting of nitric acid, hydrochloric acid, sulfuric acid, lactic acid, acetic acid, oxalic acid, citric acid, malic acid, succinic acid, butyric acid and malonic acid,(d) at least one anticorrosive selected from the group consisting of benzotriazole, benzimidazole, triazole, imidazole, tolyltriazole and their derivatives, and(e) water.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.