Electroplating process
US6565731B1 · kind B1 · utility
11Cited by
10References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 3, 1997 |
| Grant date | May 20, 2003 |
| Priority date | — |
| Expiry date | Oct 1, 2019 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D5/56
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A process for electroplating a substrate by coating the substrate with a coating of conductive particles. The process is characterized by a pretreatment sequence that includes contact of the substrate with a single solution containing a reducing agent and a polyelectrolyte. The use of the single solution decreases the incidence of interconnect defects in printed circuit manufacture.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.