Method for making a contactless card with antenna connected with soldered wires
US6566163B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 24, 1999 |
| Grant date | May 20, 2003 |
| Priority date | — |
| Expiry date | Sep 24, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention concerns a method of making contactless smart cards. To facilitate the fixing of an integrated circuit chip in a contactless smart card, and in particular the chip connection with the antenna incorporated in the card, the method consists in soldering on the chip contact pads a gold wire with at least one end projecting above the chip. The wire is preferably soldered while the chip is still part of a semiconductor wafer. The wire can be soldered between two contact pads on a common chip; it can also be soldered between two contact pads of two adjacent chips on the wafer and then sawed during dicing. When the chip is incorporated in the card, it is pressed against the antenna so that the soldered wire is in contact with the coiled or printed antenna feeder end.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.