Method and apparatus for planarizing a wafer surface of a semiconductor wafer having an elevated portion extending therefrom
US6566268B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 25, 2002 |
| Grant date | May 20, 2003 |
| Priority date | — |
| Expiry date | Jul 25, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/31053
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of planarizing a wafer surface of a semiconductor wafer having an elevated portion extending therefrom is described. The method includes the step of positioning a fluid flow surface relative to the wafer surface so that (i) a space is defined between the wafer surface and the fluid flow surface, and (ii) the elevated portion of the semiconductor wafer is positioned in the space. The method also includes the step of advancing a fluid within the space so that the fluid contacts and erodes the elevated portion of the semiconductor wafer. An associated apparatus for planarizing a wafer surface of a semiconductor wafer having an elevated portion extending therefrom is also described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.