Curing method to cure epoxy resins in a short time, and a method for absorbing electromagnetic wave through cured epoxy resins obtained by said curing method
US6566414B2 · kind B2 · utility
9Cited by
23References
14Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Jul 6, 2001 |
| Grant date | May 20, 2003 |
| Priority date | — |
| Expiry date | Jul 6, 2021 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08J2363/00
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
The present invention is a short time curing method of epoxy resin compositions composed of epoxy resins with more than 1.8 epoxy groups and curing agents which can react with epoxy groups and cure the epoxy resins at ambient temperatures or under the temperature raising conditions radiating microwave in the range of 300 MHz to 30 GHz frequency.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.