Stacking multiple devices using direct soldering
US6566610B1 · kind B1 · utility
2Cited by
6References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 1, 2001 |
| Grant date | May 20, 2003 |
| Priority date | — |
| Expiry date | Nov 1, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49147
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In one embodiment of the invention, a stacking element includes a printed circuit board (PCB) and a plurality of solder bumps. The PCB has a top side and a bottom side. The top side is attached to first pins of a first device. The plurality of solder bumps are on the bottom side and attached to upper areas of second pins of a second device to provide electrical connections between the first pins and the second pins.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.