Grounding of package substrates
US6566741B2 · kind B2 · utility
7Cited by
4References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 21, 1999 |
| Grant date | May 20, 2003 |
| Priority date | — |
| Expiry date | Oct 21, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19041
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus and method for dissipating static electrical charge following a manufacturing operation is disclosed. A semiconductor package is provided with ground pads that are located to assure electrical contact with ejection pins used to translate the package from one position to another. Static electricity builds up on the semiconductor package. The ejection pins provide the pathway for dissipating static electrical charge out of the semiconductor package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.