Integrated circuit packages assembled utilizing fluidic self-assembly
US6566744B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 21, 2002 |
| Grant date | May 20, 2003 |
| Priority date | — |
| Expiry date | Jun 21, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49133
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Assembly of integrated circuit packages, such as BGA packaged devices, using fluidic self-assembly. Functional components, such as integrated circuits, having a wired side are suspended in a fluid and flowed over a substrate. The substrate has a top first dielectric layer and recessed receptor regions for receiving the functional components. The functional components are deposited in the receptor regions using fluidic self-assembly such that the wired side is facing outward from the receptor region. A conductive layer is then formed on the first dielectric layer to form conductive interconnects to the functional components. A second dielectric layer is then formed on the conductive layer. The second dielectric layer has openings for receiving conductive elements. Conductive elements, such as solder balls, are deposited into the openings in the second dielectric layer and contact the conductive layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.