Image sensor ball grid array package and the fabrication thereof
US6566745B1 · kind B1 · utility
202Cited by
6References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 29, 2000 |
| Grant date | May 20, 2003 |
| Priority date | — |
| Expiry date | Mar 29, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16235
Abstract
The present invention is related to an image sensor packaging technique based on a Ball Grid Array (BGA) IC packaging technique, further referred to as image sensor ball grid array (ISBGA). A transparent cover is attached to a semiconductor substrate. Depending on the method of attaching the cover to the substrate a hermetic or non-hermitic sealing is obtained. The obtained structure can be connected trough wire-bonding or flip chip connection.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.