Thin film magnetic head including a coil insulating resin filler and an insulating metallic layer covering at least partly the insulating resin filler on a datum plane
US6567239B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 20, 2000 |
| Grant date | May 20, 2003 |
| Priority date | — |
| Expiry date | Feb 1, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49073
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A liquid resist is introduced between adjacent conductive lines of a coil pattern girdling around a magnetic core piece. When the liquid resist is cured, an insulating resin filler can be fixed between the adjacent conductive lines of the coil pattern. An insulating metallic layer is formed to extend over the insulting resin filler and the conductive lines of the coil pattern. Thereafter, the insulating metallic layer is subjected to a flattening grinding treatment until at least a part of the conductive line is exposed at a flattened surface. Since the liquid of the resist, of a higher fluidity, penetrates in every hole and corner between the adjacent conductive lines, the gap defined between the adjacent conductive lines is fully filled with the insulating material. No voids remain in the gap. The conductive line of the coil can be reliably prevented from corrosion or oxidation. Moreover, a relatively brittle of fragile insulating resin filler is reliably prevented from being subjected to the flattening grinding treatment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.