Indium plated package for an optical component and process therefore
US6567604B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 25, 2000 |
| Grant date | May 20, 2003 |
| Priority date | — |
| Expiry date | Oct 25, 2020 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4238
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A device capable of receiving an optical fiber through an orifice in the housing of the device. The housing having a gold surface over a substrate material. An indium layer is located on the gold surface. A solder joint is formed with the indium layer covering the gold surface to have indium silver solder surrounding the fiber and maintaining the fiber in a desired position with the housing. The indium layer can be formed of pure indium and the solder joint is formed of indium silver solder having about 97% indium and about 3% silver. The fiber or fibers may be metallized with a pure indium coating. The indium silver solder joint can provide an improved hermetic seal at fiber entrances and exits of the device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.