Implantable medical device incorporating miniaturized circuit module
US6567703B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 8, 2000 |
| Grant date | May 20, 2003 |
| Priority date | — |
| Expiry date | Jun 13, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S977/94
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
Implantable medical devices (IMDS) having RF telemetry capabilities for uplink transmitting patient data and downlink receiving programming commands to and from an external programmer having an improved RF module configured to occupy small spaces within the IMD housing to further effect the miniaturization thereof. An RF module formed of an RF module substrate and at least one IC chip and discrete components has a volume and dimensions that are optimally minimized to reduce its volumetric form factor. Miniaturization techniques include: (1) integrating inductors into one or more IC chips mounted to the RF module substrate; (2) mounting each IC chip into a well of the RF module substrate and using short bonding wires to electrically connect bond pads of the RF module substrate and the IC chip; and (3) surface mounting discrete capacitors over IC chips to reduce space taken up on the RF module substrate. The integrated inductors are preferably fabricated as planar spiral wound conductive traces formed of high conductive metals to reduce trace height and width while maintaining low resistance, thereby reducing parasitic capacitances between adjacent trace side walls and with a ground …
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.