Method and system for automated on-chip material and structural certification of MEMS devices
US6567715B1 · kind B1 · utility
54Cited by
9References
36Claims
0Family size
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Key dates
| Filing date | Apr 19, 2000 |
| Grant date | May 20, 2003 |
| Priority date | — |
| Expiry date | Apr 19, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C99/005
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A new approach toward MEMS quality control and materials characterization is provided by a combined test structure measurement and mechanical response modeling approach. Simple test structures are cofabricated with the MEMS devices being produced. These test structures are designed to isolate certain types of physical response, so that measurement of their behavior under applied stress can be easily interpreted as quality control and material properties information.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.