Low application temperature hot melt adhesive for cigarette preparation
US6568399B1 · kind B1 · utility
7Cited by
24References
33Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 26, 1999 |
| Grant date | May 27, 2003 |
| Priority date | — |
| Expiry date | Apr 26, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31935
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A cigarette filter, process to manufacture, wherein a low application temperature ethylene copolymer based hot melt adhesive is applied to porous and/or nonporous plugwrap paper. As used herein, low application temperatures are temperature between 200° F. and 300° F. (93° C. and 149° C.), preferably, 240° F. to 275° F. (115° C. to 135° C.).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.