Process for cutting out panels or the like
US6569272B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 4, 2001 |
| Grant date | May 27, 2003 |
| Priority date | — |
| Expiry date | Jul 28, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/167
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A wood fiber board (6) which is provided with a decorative layer (3) of paper or similar material, and where the length or width value of the decorative layer (3) deviates from its original value after it is applied to the wood fiber board (6), is cut into uniform panels using a board-dividing apparatus that compensates for these deviations. The board-dividing apparatus has a saw (1) that preferably has a plurality of saw blades (S1, S2, . . . Sn) which are adjustably spaced in parallel fashion. The board-dividing apparatus is equipped with a number of cameras and with controller which utilizes deviation measurement information to adjust the spacing of the saw blades. The wood fiber board (6) is first aligned with at least one initial camera (4a) at a point P1. Then, predetermined points (P1 and P2) in the decorative layer (3) are recorded by the first camera (4a) and a second camera (4b). A distance (L) between the points (P1 and P2) is determined, and thee discrepancy in the width or length value is determined by comparison of the actual position and the desired position of the points (P1 and P2). Then, the value of the determined discrepancy (A) is placed in relation to the numb…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.