Method for grading surface topography for improved step coverage and planarization
US6569295B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 20, 2001 |
| Grant date | May 27, 2003 |
| Priority date | — |
| Expiry date | Mar 20, 2021 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B5/3163
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method is provided for grading the surface topography of a surface to improve step coverage for an overcoat. In accordance with one aspect of the present invention, an ABS of a slider and sensitive element of a magnetic head is graded to provide better step coverage of an overcoat of ultra-thin DLC film. After lapping the ABS, a thin film is deposited on the lapped surface to cover any scratches, irregularities, and steps. The thin film is sputter etched at a glancing angle to grade the topography of the slider ABS. Sputtering at a glancing angle removes the thin film in planar regions faster than the thin film under the shadow of the glancing angle, which is near surface irregularities. The graded surface is then covered by a DLC deposition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.