Thermoplastic silicone elastomers from compatibilized polyamide resins
US6569955B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 19, 2001 |
| Grant date | May 27, 2003 |
| Priority date | — |
| Expiry date | Dec 6, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S525/903
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A method for preparing a thermoplastic elastomer is disclosed, said method comprising:(I) mixing(A) a Theologically stable polyamide resin having a melting point or glass transition temperature of 25° C. to 275° C.,(B) a silicone base comprising a diorganopolysiloxane gum having a plasticity of at least 30 and having an average of at least 2 alkenyl groups in its molecule and optionally(B″) 5 to 200 parts by weight of a reinforcing filler, the weight ratio of said silicone base to said polyamide resin is from 35:65 to 85:15,(C) a compatibilizer selected from glycidyl ester polymers or organofunctional grafted polyolefins,(D) an organohydrido silicon compound which contains an average of at least 2 silicon-bonded hydrogen groups in its molecule and(E) a hydrosilation catalyst, components (D) and (E) being present in an amount sufficient to cure said diorganopolysiloxane (B′); and(II) dynamically curing said diorganopolysiloxane (B′).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.