Curable resin compositions
US6569980B1 · kind B1 · utility
16Cited by
8References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 20, 2001 |
| Grant date | May 27, 2003 |
| Priority date | — |
| Expiry date | Sep 20, 2021 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L83/10
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
To provide curable resin compositions capable of exhibiting a low modulus, a high break strength, a high elongation and a satisfactory water-resistant adhesiveness to mortar. One of which includes (a) an organic polymer having at least one reactive silicon group in one molecule, (b) an amino group-substituted silane compound, and (c) an epoxy group-substituted silane compound; and another of which includes (a) an organic polymer having at least one reactive silicon group in one molecule, (b) an amino group-substituted silane compound, (c) an epoxy group-substituted silane compound, and (d) an epoxy resin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.