Cooling structure of communication device
US6570086B1 · kind B1 · utility
37Cited by
3References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 5, 2002 |
| Grant date | May 27, 2003 |
| Priority date | — |
| Expiry date | Feb 5, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K9/0026
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A communication device includes a communication circuit mounted on a printed substrate and having a heat generating element; a shield casing covering the communication circuit and shielding electromagnetic waves; a housing accommodating the shield casing and the printed substrate; a heat diffusing member mounted along an inner wall of the shield casing diffusing heat in a planar direction; and a heat insulating layer disposed between the shield casing and an inner wall of the housing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.