Thermal conductive substrate and the method for manufacturing the same
US6570099B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 23, 2000 |
| Grant date | May 27, 2003 |
| Priority date | — |
| Expiry date | Oct 23, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/253
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A thermal conductive substrate includes a first electrical insulator layer, a second electrical insulator layer and a lead frame serving as a circuit pattern. The first electrical insulator layer is formed of a thermal conductive resin composition containing a thermosetting resin and an inorganic filler, and is joined to the lead frame. The second electrical insulator layer is provided on the side of the first electrical insulator layer not in contact with the lead frame, and is formed of a thermal conductive resin composition containing the inorganic filler and a resin composition containing the thermosetting resin. The second electrical insulator layer has a higher thermal conductivity than the first electrical insulator layer. Thus, it is possible to achieve higher heat-radiating characteristics and component packaging reliability without deteriorating formability and adhesive characteristics of the electrical insulator layers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.