Patent · US Expired

Semiconductor device and method of manufacturing the same

US6570203B2 · kind B2 · utility

20Cited by
8References
12Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMar 29, 2001
Grant dateMay 27, 2003
Priority date
Expiry dateAug 2, 2021

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH10B12/312

Abstract

There is provided a semiconductor device which comprises a capacitor including a lower electrode, a dielectric film, and an upper electrode, a first protection film formed on the capacitor, a first wiring formed on the first protection film, a first insulating film formed on the first wiring, a second wiring formed on the first insulating film, a second insulating film formed on the second wiring, and at least one of a second protection film formed between the first insulating film and the first wiring to cover at least the capacitor and a third protection film formed on the second insulating film to cover the capacitor and set to an earth potential. Accordingly, the degradation of the ferroelectric capacitor formed under the multi-layered wiring structure can be suppressed.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.