High frequency apparatus
US6570464B1 · kind B1 · utility
4Cited by
6References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 25, 2000 |
| Grant date | May 27, 2003 |
| Priority date | — |
| Expiry date | Aug 25, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01P11/003
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A high frequency apparatus includes a dielectric substrate having a surface including a first area and at least one second area; a first dielectric thin layer provided on a portion of a first area; and a uniplanar transmission line provided on the first dielectric thin layer and on a portion of the second area, the uniplanar transmission line extending, continuously on the second area and the first dielectric thin layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.