Multilayer ceramic device including two ceramic layers with multilayer circuit patterns that can support semiconductor and saw chips
US6570469B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 27, 2001 |
| Grant date | May 27, 2003 |
| Priority date | — |
| Expiry date | Sep 4, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/4697
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multilayer ceramic device improves device functionality, reduces overall device size and profile, makes manufacturing easier, and improves reliability. A first ceramic layer has a first multilayer circuit pattern electrically connected through via holes. Also, a second ceramic layer has a second multilayer circuit pattern electrically connected through via holes. A thermosetting resin sheet is disposed between the first and second ceramic layers. The thermosetting resin sheet has through holes filled with a conductive paste for electrically connecting one of multiple circuit pattern layers in the first ceramic layer with one of multiple circuit pattern layers in the second ceramic layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.