Method for manufacturing modular board
US6571469B2 · kind B2 · utility
3Cited by
5References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 26, 2001 |
| Grant date | Jun 3, 2003 |
| Priority date | — |
| Expiry date | May 24, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4979
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A blanking plate is attached to the bottom surfaces of a split board and a remaining board, which are separated from one bare board. After depositing solder paste on a back electrode of the split board, a solder ball is attached on the solder paste. The split board is then heated to melt the solder ball. The molten solder flows along the back electrode and an edge electrode into a through-hole. A portion of the molten solder swells out of the bottom surface of the bare board, and solidifies and bonds to the back electrode and the edge electrode.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.