Method of thermally perforating a heat sensitive stencil
US6571699B2 · kind B2 · utility
0Cited by
4References
6Claims
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Key dates
| Filing date | May 17, 2001 |
| Grant date | Jun 3, 2003 |
| Priority date | — |
| Expiry date | Jun 28, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24331
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A stencil is made by thermally forming perforations arranged in both a main scanning direction and a sub-scanning direction in a thermoplastic resin film of heat-sensitive stencil material by the use of a heat source which is heated through supply of energy. Supply of energy to the heat source is cut so that the quotient obtained by dividing a maximum diameter of a perforation at the time at which supply of energy to the heat source is cut by the energizing time is not smaller than 0.015 m/s and not larger than 0.23 m/s.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.